UV-curable,Transparent,and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation
简介：Mini light-emitting diodes(Mini-LEDs)show great application potential in high-end displays owing to their superior pixel density,brightness,responsiveness,and efficiency.However,current packaging materials for Mini-LEDs are predominantly thermally cured,which is ener-gy-and time-consuming and can adversely affect electronic components.In this study,a novel UV-curable silicone resin containing phenyl,disul-fide,and acryloyl groups(SPASR)is developed from commercially available siloxanes.The resin exhibits a refractive index(nd)higher than 1.5,and it can be cured within 30 s under UV irradiation.After curing,it exhibits an optical transparency exceeding 92％,a lap adhesion strength of up to 1.84 MPa,and good thermostability(T5％＞265 ℃).Notably,the volume shrinkage is less than 4.83％,attributed to the release of photopolymeriza-tion stress via UV-induced disulfide metathesis during UV curing.Mini-LEDs encapsulated with this resin show luminescence properties compara-ble to those of conventional thermally-cured sealants,and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h.Consequently,these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation,offering a more re-liable and efficient solution for the electronics industry.展开
学者：Zi-HuaZhangJuanYEWei-ShanWENQing-HongLuoHong-PingXiang
关键词：UV-curing technologySilicone resinMini-LEDs encapsulantsLow volume shrinkageDisulfide metathesis
在线出版日期：2026-04-03 （网站首发日期）
